Siemens Server Module, For Use With: SIPLUS ET 200SP Distributed I/O System, Specifications: -40 to 70 deg C Operating Temperature, 117 mm H x 7 mm W x 36 mm D Dimensions
WEEE 2012/19/EU|REACH Article No. 33|ECCN: EAR99H
Siemens Server Module, For Use With: SIPLUS ET 200SP Distributed I/O System, Specifications: -40 to 70 deg C Operating Temperature, 117 mm H x 7 mm W x 36 mm D Dimensions
Dimensions
117 mm H x 7 mm W x 36 mm D
Specifications
-40 to 70 deg C Operating Temperature
Suitable For Use With
SIPLUS ET 200SP Distributed I/O System
Brand
Siemens
Manufacturer
Siemens